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2 article(s) from Dutta, Amlan

Plasticity-mediated collapse and recrystallization in hollow copper nanowires: a molecular dynamics simulation

Amlan Dutta,
Arup Kumar Raychaudhuri and
Tanusri Saha-Dasgupta

Beilstein J. Nanotechnol. 2016, 7, 228–235, doi:10.3762/bjnano.7.21

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Figure 1: Simulation snapshots at 700 K, taken at different points in time (0, 4, 12 and 20 ps) spanning the ...

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Figure 2: (a) Simulation snapshots at 700 K, taken at different points in time (24, 46 and 54 ps) spanning th...

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Figure 3: (a) Simulation snapshots at 700 K, taken at different points in time (80, 360, 800 and 1230 ps) spa...

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Figure 4: Snapshot of the nanostructure at 575 K temperature taken at t = 68 ps. As the snapshot shows, at th...

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Figure 5: The potential energy of the simulated nanostructures as a function of the time at (a) low-temperatu...

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Figure 6: Radius of gyration plotted as a function of the simulation time for several temperatures belonging ...

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Figure 7: (a) Double exponential fit to the mean atomic volume of the simulated nanostructure as a function o...

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Full Research Paper

Published 10 Feb 2016

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Simulation of thermal stress and buckling instability in Si/Ge and Ge/Si core/shell nanowires

Suvankar Das,
Amitava Moitra,
Mishreyee Bhattacharya and
Amlan Dutta

Beilstein J. Nanotechnol. 2015, 6, 1970–1977, doi:10.3762/bjnano.6.201

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Figure 1: Methods for computing Young’s modulus and the thermal expansion coefficient: (a) Young’s modulus is...

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Figure 2: Variation of Young’s modulus with the core diameter of the (a) <111> and (b) <110>-oriented core/sh...

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Figure 3: Quantum scaling between the real and classical (MD) temperatures for the (a) Si/Ge <111>, (b) Ge/Si...

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Figure 4: Coefficients of thermal expansion plotted against the core diameter of Si/Ge and Ge/Si CSNWs orient...

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Figure 5: Temperature derivatives of thermal stress at 300 K for the (a) <111>- and (b) <110>-oriented wires ...

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Figure 6: Stability diagrams for CSNWs of (a) Si/Ge <111>, (b) Ge/Si <111>, (c) Si/Ge <110> and (d) Ge/Si <11...

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Full Research Paper

Published 02 Oct 2015

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